Product Description: Solder Flux 10cc Original USA NC-559-ASMUV (TFP)
The Solder Flux 10cc Original USA NC-559-ASMUV (TFP) is a high-performance no-clean soldering flux designed for various electronic applications. This flux is ideal for reworking and repairing printed circuit boards (PCBs), ensuring excellent solderability and adhesion while leaving minimal residue. It is particularly effective for BGA, SMD, and other surface mount technologies.
Features
- No-Clean Formula: Designed to leave a clear residue that does not require cleaning after soldering, saving time and effort.
- Excellent Adhesion: Provides strong bonding capabilities for various solder types, enhancing the reliability of connections.
- Versatile Application: Suitable for use with lead-free and tin-lead soldering processes, making it ideal for diverse projects.
- Low Viscosity: The flux has a low viscosity (around 80 mPa.s), allowing for easy application and penetration into tight spaces.
- Environmentally Friendly: Halogen-free formulation ensures compliance with environmental regulations.
Application
The NC-559-ASMUV (TFP) solder flux is perfect for:
- Electronics Repair: Ideal for repairing and reworking PCBs, particularly in mobile devices and computers.
- Soldering BGA and SMD Components: Provides optimal performance for soldering ball grid arrays (BGAs) and surface mount devices (SMDs).
- General Soldering Tasks: Suitable for various soldering applications in both professional and DIY environments.
Package Included: 1 x Solder Flux 10cc Original USA NC-559-ASMUV (TFP). Please note that the product image is for illustrative purposes only. The actual product may vary slightly in appearance!
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